Medium-Frequency Coating Power Supply: Iterative Advancements in Energy-Saving Technologies Accelerate, with Dual-Track Expansion into New Energy and Semiconductor Applications
In 2025, the mid-frequency coating power supply industry will seize a dual opportunity—technological upgrades and expanded application scope. Energy-saving performance and process compatibility will become the core competitive dimensions. Relying on an innovative combination of amorphous alloy materials and three-dimensional wound-core structures, the new-generation products have generally achieved efficiency exceeding 99.5%. No-load losses have been reduced by 3.2% compared to the first-level energy consumption standard, enabling each unit to save up to 180,000 kilowatt-hours of electricity annually, which translates into a reduction of 149.6 tons of carbon dioxide emissions. Thanks to these energy-saving advantages, these products are rapidly penetrating fields such as photovoltaic coating and semiconductor wafer processing; by 2025, the share of related applications has already exceeded 50%.
The market landscape is characterized by “breaking through at the high end and consolidating at the low end.” In the semiconductor sector, demand for high-precision plating power supplies tailored for 12-inch wafers has surged, calling for power supplies with a wide-frequency output range of 0.1 Hz to 10 kHz and current stability within ±0.5%. Meanwhile, in the photovoltaic sector, compact design has become a key factor; through structural optimization, equipment footprint has been reduced by 30%, making it well-suited to the space constraints of new-energy bases such as those located in sandy and barren regions. On the raw materials front, the localization rate of domestically produced IGBT modules has reached 51%, driving down the cost of medium-frequency plating power supplies by 12% compared to 2023 levels and accelerating the process of import substitution.
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